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L&T Technology Services supports Marelli in revolutionizing automotive infotainment

Company’s innovative SDV solutions built on AWS & Snapdragon Cockpit Platform from Qualcomm, cuts software development and prototype costs. The groundbreaking solution was showcased at the Consumer Electronics Show (CES) 2024, held in Las Vegas in January 2024. Read more

Low-profile power inductor for advanced driver assistance systems

TDK Corporation announces the MLD2012 multilayer inductor for automotive power circuits. The new component that is based on a ferrite core is available in a compact IEC 2012 (EIA 0805) package with a footprint of 2.0 mm x 1.25 mm and an insertion height of just 0.5 mm.Read more

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